HTS 8100
Vapor Deposition System

The HTS 8100 Vapor Deposition System is the first high throughput production system for applying lubricating films to the surfaces of MEMS devices. These coatings reduce surface tension and eliminate STICTION of micro mechanical surfaces. The HTS 8100 has the capacity to process up to 24, 300mm substrates per hour.

The HTS 8100 three chamber design allows users to deposit on up to three different products at the same time. The software recipe editor allows the user to define all of the process variables for a multitude of processes and products. These two features combined enables the user to develop new processes and products in the same system that they are running production. The dual source feature eliminates maintenance down time and allows production to continue during source recharging and conditioning.

System Features
  • Three fully Integrated Process Chambers
  • Two Vapor Sources
  • Recovery trap
  • Fully Automated process control
  • Manual or Auto loading of substrates
Source Features
  • Capacity - 750 Grams
  • Maximum Temperature - 160 C
  • Temperature stability during delivery +/- .2 C
  • Controlled Vapor Saturation
  • Operating pressure range - 1 Torr to 760 torr
  • Vacuum Bypass for source conditioning
  • Delivery Rate - .2 Grams/Min
Chamber Features
  • Substrate capacity - 300mm X 300mm X 38mm
  • Maximum temperature - 150 C +/- .1 C
  • Temp uniformity +/- .01 C
  • Base pressure - <10-6 Torr
  • Dual Vapor Injectors for high deposition uniformity
  • Infinitely variable pumping speed
  • Variable Vapor delivery speed
  • Variable/Ramp N2 vent
Process control features
  • Recipe Editor
  • Variable pumping speed
  • Variable delivery rate
  • Slow/Fast vent
  • Pre/Post Process Purge and pump cycles
  • Full data logging
  • Communications/Remote Access
  • PID loop temperature controls
Trap Features
  • Maximum Capacity - 750 Grams
  • Running capture rate - 100% up to 100 grams
  • Regeneration Time - 20 Minutes