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HTS 9100 Vapor Deposition System

System Features
  • Single chamber
  • Single vapor source
  • Recovery trap
  • Fully automated process control
  • Manual or automatic loading of cassette
Source Features
  • Capacity - 750 Grams
  • Maximum temperature - 160 C
  • Temperature stability during delivery +/- .2C
  • Controlled vapor saturation
  • Operating pressure range - 1 to 760 torr
  • Vacuum bypass for source conditioning
  • Delivery rate - .2 Grams/min
Process Control Features
  • Recipe editor
  • Slow/fast vent
  • Full data logging
  • Maximum temperature 150 C +/- .1C
  • Infinitely variable pumping speed
  • Variable vapor delivery
  • Pre/post process purge and pump cycles
  • Communications/remote access
  • PID loop temperature controls
The HTS 9100 Vapor Deposition System was developed for MEMS manufacturers that use Wafer Level Packaging. This system incorporates a single process chamber that will accept a cassette of 24, 200mm substrates in a single process run. By incorporating a SMIF-pod cassette loader the substrates are protected from contaminates in the environment.